首页> 外文期刊>Nuclear Instruments & Methods in Physics Research. B, Beam Interactions with Materials and Atoms >Pulse plating of Pt on n-GaAs (100) wafer surfaces: Synchrotron induced photoelectron spectroscopy and XPS of wet fabrication processes
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Pulse plating of Pt on n-GaAs (100) wafer surfaces: Synchrotron induced photoelectron spectroscopy and XPS of wet fabrication processes

机译:在n-GaAs(100)晶片表面上进行Pt的脉冲电镀:同步加速器诱导的光电子能谱和湿法制造工艺的XPS

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摘要

Preparation steps of Pt-GaAs Schottky contacts as applied in the fabrication process of varactor diode arrays for THz applications are analysed by photoelectron spectroscopy. Pulsed cathodic deposition of Pt onto GaAs (1 00) wafer surfaces from acidic solution has been studied by core level photoelectron spectroscopy using different excitation energies. A laboratory AlKα source as well as synchrotron radiation of hv = 130 and 645 eV at BESSY was used. Chemical analyses and semiquantitative estimates of layer thickness are given for the natural oxide of an untreated wafer surface, a surface conditioning NH_3 etching step, and stepwise pulse plating of Pt. The structural arrangement of the detected species and interface potentials are considered.
机译:通过光电子能谱分析了用于太赫兹应用的变容二极管阵列制造过程中所应用的Pt / n-GaAs肖特基接触的制备步骤。已经通过使用不同激发能的核能级光电子能谱研究了从酸性溶液将Pt脉冲阴极沉积到GaAs(1 00)晶片表面上。使用实验室AlKα源以及在BESSY处hv = 130和645 eV的同步辐射。针对未经处理的晶圆表面的天然氧化物,表面调节NH_3蚀刻步骤以及Pt的逐步脉冲镀膜,进行了化学分析和层厚度的半定量估算。考虑所检测物种的结构布置和界面电势。

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