A new acidic ILD slurry formulation for advanced CMP

摘要

For advanced interlayer dielectric (ILD) CMP slurry, it is highly desirable to achieve enhanced polishing efficiency and performance with reduced overall cost of ownership (CoO). A colloidal-silica based acidic ILD slurry,† was thus designed for accurate manipulation of the particle/wafer interaction by leveraging the use of proprietary additive. NMR studies were conducted to quantitatively understand particle adsorption and zeta potential of abrasives and polished films were characterized to establish the correlation of electrostatic forces to removal rate. The formulation of the slurry is optimized in such a way to reflect the maximized benefits particularly when applied together with Dow leading CMP pads.