Characterizing recycled fumed silica slurries in ILD CMP applications

摘要

Chemical-mechanical polishing (CMP) technology has played an enabling role in attaining near-perfect planarity of interconnection and metal layers, an essential step for realizing and miniaturizing high-performance devices. To ensure stable and high-performance CMP characteristics, optimization of the slurry, the pad, and other consumables is critical. Additionally, the relatively high cost of ownership associated with CMP consumables warrants novel approaches to reduce these expenses.