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Enhancement and Depletion-Mode pHEMT Using 6 inch GaAs Cost-effective Production Process

机译:使用6英寸GaAs具有成本效益生产过程的增强和耗尽模式PHEMT

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A cost effective Enhancement/Depletion mode pHEMT MMIC process on 6-inch GaAs wafer is demonstrated by using 0.5um gate-length optical stepper pHEMT technology. E-mode and D-mode gates are deposited simultaneously in this process simplification. The E-mode pHEMT exhibits a pinch-off voltage of +0.22V (defined at 0.1mA/mm), and a maximum extrinsic transconductance of 400mS/mm at room temperature. The off-state current of E-mode device is typically 0.15uA/mm at Vgs=0V and Vds=3V. This current is extreme low and is suitable for high density digital circuits with minimized power consumption. On the other hand, a pinch-off voltage of -0.75V and a transconductance of 370mS/mm has been measured for D-mode pHEMT. Due to excellent DC/RF characteristics and good uniformity of E/D pHEMTs from optimized optical gate lithography and front-side process, the D-mode Switch and E-mode digital control circuit constitute a monolithic solution to RF control circuits in WLAN and cell phone applications.
机译:通过使用0.5um栅极长度光学步进PHEMT技术来证明6英寸GaAs晶片上的成本有效的增强/耗尽模式PhEMT MMIC工艺。 在该过程中同时沉积E模式和D模式栅极。 E模式PHEMT表现出+ 0.22V(定义为0.1mA / mm)的夹紧电压,在室温下为400ms / mm的最大外部跨导。 E模式设备的断开电流通常为0.15ua / mm,Vgs = 0v和Vds = 3V。 该电流极低,适用于具有最小化功耗的高密度数字电路。 另一方面,针对D模式PHEMT测量了-0.75V的夹紧电压和370ms / mm的跨导。 由于优异的DC / RF特性和来自优化光栅光刻和前侧工艺的E / D PHEMT的良好均匀性,D模式开关和电子模式数字控制电路构成了WLAN和CELL的RF控制电路的单片解决方案 手机应用程序。

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