首页> 外国专利> ENHANCEMENT AND DEPLETION-MODE PHEMT DEVICE HAVING TWO InGaP ETCH-STOP LAYERS AND METHOD OF FORMING SAME

ENHANCEMENT AND DEPLETION-MODE PHEMT DEVICE HAVING TWO InGaP ETCH-STOP LAYERS AND METHOD OF FORMING SAME

机译:具有两个InGaP刻蚀停止层的增强和耗尽模式PHEMT装置及其形成方法

摘要

depletion / enhancement PHEMT ((pseudomorphic high electron mobility transistor, pseudomorphic high electron mobility transistor) device structure is presented the structure of (a) a semiconductor substrate;. (b) a buffer region comprising one or more semiconductor buffer layer on the substrate; (c) - above, the buffer area semiconductor channel layer; (d) Above the channel layer of the electron donor layer, in (f) the gallium arsenide or aluminum gallium arsenide, the first schottky layer over the first InGaP; (e) the electron donor layer over an aluminum gallium arsenide or gallium arsenide first schottky layer layer; (g) the first InGaP layer over the gallium arsenide or aluminum gallium arsenide, the second schottky layer; (h) a GaAs or aluminum gallium arsenide of the second schottky layer above the second InGaP layer, ( i) the second InGaP layer above the doped GaAs contact layer; (j) is extending from the top surface of the group the contact layer at least to the buffer area, isolation structure defining a first active region and a second active region ; extending out from the top surface of the (l) the doped GaAs contact layer, wherein; (k) increase-resistance source contact disposed on the doped GaAs contact layer and an enhancement ohmic drain contact in the first active region enhancement gate through the first InGaP layer in a first active area recess (recess); (m) a GaAs or aluminum gallium arsenide disposed over the first schottky layer within the enhancement gate recess the increase gate contact; extending out from the top surface of the (o) a doped GaAs contact layer; (n) the second active depletion disposed on the doped GaAs contact layer in the region ohmic source contact and a depletion ohmic drain contact and the second passing through the second InGaP layer in the active region a depletion gate recess; and (p) arranged on the ball or aluminum gallium arsenide GaAs of the second schottky layer within the depletion gate recess It characterized in that it includes a gate contact piphyeong.
机译:提出了一种耗尽/增强PHEMT((伪高电子迁移率晶体管,伪高电子迁移率晶体管)器件结构,该结构包括:(a)半导体衬底;(b)在衬底上包括一个或多个半导体缓冲层的缓冲区域; (c)-上方的缓冲区域半导体沟道层;(d)在电子给予体层的沟道层上方,在(f)砷化镓或砷化铝镓中,第一InGaP上方的第一肖特基层;(e) (a)砷化铝镓或砷化镓第一肖特基层上的电子给体层;(g)砷化镓或砷化铝镓上的第一InGaP层;第二肖特基层;(h)第二砷化镓或GaAs或砷化铝镓在第二InGaP层上方的肖特基层,(i)掺杂的GaAs接触层上方的第二InGaP层;(j)从该接触层组的顶表面至少延伸到缓冲区定义第一有源区和第二有源区的隔离结构;从(l)的掺杂的GaAs接触层的顶表面伸出,其中; (k)设置在掺杂的GaAs接触层上的增加电阻的源极接触和通过第一InGaP层在第一有源区凹槽(凹口)中的第一有源区增强栅中的增强欧姆漏极接触; (m)GaAs或砷化铝镓镓,位于增强栅极凹槽内的第一肖特基层上方,以增加栅极接触;从(o)的顶表面延伸出掺杂的GaAs接触层; (n)第二有源耗尽层,设置在欧姆源极接触区和耗尽型欧姆漏极接触区中的掺杂GaAs接触层上,第二有源耗尽层穿过有源区中的第二InGaP层,形成耗尽栅凹槽; (p)在耗尽型栅极凹部内的第二肖特基层的球状或砷化铝镓GaAs上配置。

著录项

  • 公开/公告号KR100939037B1

    专利类型

  • 公开/公告日2010-01-27

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020027475

  • 发明设计人 단지리오데이비드마크.;

    申请日2002-05-17

  • 分类号H01L29/778;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:31

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号