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A 0.996mW 10GHz slicer with 20mV input resolution in 65nm CMOS

机译:0.996mW 10GHz切片器,在65nm CMOS中具有20mV的输入分辨率

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In high-speed serial communication interface circuits, a high-performance slicer is essential. This paper presents an improved slicer based on SA/FF (Sense Amplifier/Flip Flop) and extracts the sample function of whole circuit system. The results show that the proposed configuration can achieve a regeneration gain of 61.8dB and a ???3dB bandwidth of 10GHz. The power consumption of the new structure is 0.996mW at 10GHz, and the input resolution is 20mV under this clock frequency. Besides, the delay of slicer is independent on the variation of common mode voltage.
机译:在高速串行通信接口电路中,高性能切片器至关重要。本文介绍了基于SA / FF(检测放大器/触发器)的改进切片机,提取整个电路系统的样本功能。结果表明,所提出的配置可以实现61.8dB的再生增益和10GHz的3DB带宽。新结构的功耗为0.996MW,10GHz,在此时钟频率下输入分辨率为20mV。此外,切片机的延迟是独立于共模电压的变化。

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