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Printability Evaluation of Programmed Defects on OMOG Masks

机译:OMOG面罩上程序缺陷的可印刷性评估

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Opaque Mosi on Glass (OMOG) photomask, significantly less prone to mask degradation, has been applied in leading-edge photolithographic flows on 20 nm and 14 nm node. Mask defect problem occurs at any time, rooted in various causes; therefore, defect printability disposition and verification need to be evaluated for new developing process. A series of programmed defects with typical sizes and shapes have been established for different mask patterns on OMOG masks and investigated for the defect printability influences through the CDSEM, AIMS and inspection tools. The results are compiled to produce the defect specifications that can be implemented on OMOG mask fabrication.
机译:玻璃上的不透明Mosi光掩膜(OMOG)光掩膜不易发生掩膜退化,已应用于20 nm和14 nm节点上的前沿光刻工艺中。面膜缺陷问题随时都会发生,其原因多种多样;因此,对于新的显影工艺,需要评估缺陷的可印刷性处置和验证。已针对OMOG掩模上的不同掩模图案建立了一系列具有典型尺寸和形状的编程缺陷,并通过CDSEM,AIMS和检查工具研究了缺陷对可印刷性的影响。汇编结果以产生可以在OMOG掩模制造上实施的缺陷规范。

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