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Analysis of wear non-uniformity of pad in full aperture polishing

机译:全孔径抛光中垫磨损不均匀性分析

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Full aperture polishing (FAP) is the key application process that realizes low damage and ultra-smooth surface in the fabrication of large plane optical element. The polishing pad plays a vital role as a significant part in FAP. When the material of element is removed, the contact surface of pad also appears non-uniform wear, which is detrimental to polishing accuracy and efficiency. In this work, wear density (WD) is proposed to characterize wear uniformity of pad, and relative wear (RW) is used to represent the wear degree. Based on the wear density distribution model, the effect of process parameters on the pad wear is investigated. It is pointed out that when the speed difference between the element and the polishing plate is 0.2r/min to 0.5r/min, the wear track distribution of pad is relatively uniform. Furthermore, the results showed that swing has the greatest influence on the wear non-uniformity, while the traverse velocity is the smallest. In order to reduce the serious local wear, the swing can be increased according to the diameter of the polishing plate. This provides a good guidance for the optimization of FAP process.
机译:全光圈抛光(FAP)是在大平面光学元件的制造中实现低损坏和超光滑表面的关键施加过程。抛光垫在FAP中的重要作用起着至关重要的作用。当移除元件材料时,垫的接触表面也出现不均匀的磨损,这是有害的抛光精度和效率。在这项工作中,提出磨损密度(WD)来表征垫的磨损均匀性,并且使用相对磨损(RW)来表示磨损程度。基于耐磨密度分布模型,研究了工艺参数对垫磨损的影响。所指出的是,当元件和抛光板之间的速度差为0.2r / min时,垫的耐磨轨道分布相对均匀。此外,结果表明,摆动对磨损不均匀性具有最大的影响,而横向速度是最小的。为了减少严重的局部磨损,可以根据抛光板的直径增加摆动。这提供了优化FAP过程的良好指导。

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