首页> 外文会议>China Semiconductor Technology International Conference >Enlarge the process window of patterns in 22nm node by using mask topography aware OPC and SMO
【24h】

Enlarge the process window of patterns in 22nm node by using mask topography aware OPC and SMO

机译:通过使用可识别掩模拓扑的OPC和SMO扩大22nm节点中图案的处理窗口

获取原文
获取外文期刊封面目录资料

摘要

The mask three dimensional (M3D) effect of thin Opaque MoSi on Glass (OMOG) mask is analyzed by investigating the difference of diffraction orders between rigorous electro-magnetic field (EMF) simulation and thin mask approximation. Then the potential of extending the process window of AttPSM and OMOG masks with 22nm node SRAM cell patterns by using Optical Proximity Correction (OPC) and Source Mask Optimization (SMO) is compared. Both the OMOG and AttPSM masks are simulated and discussed. For this case, the results show that the overlapped process window (PW) greatly reduces without considering the M3D effects in OPC. In addition, M3D aware SMO improves the total process window one step further.
机译:通过研究严格的电磁场(EMF)模拟和薄掩模近似之间的衍射级差,分析了薄的不透明MoSi玻璃在掩模(OMOG)上的掩模三维(M3D)效应。然后比较了通过使用光学邻近校正(OPC)和源掩模优化(SMO)扩展具有22nm节点SRAM单元图案的AttPSM和OMOG掩模的处理窗口的潜力。 OMOG和AttPSM蒙版均经过仿真和讨论。对于这种情况,结果表明,在不考虑OPC中的M3D效果的情况下,重叠的过程窗口(PW)大大减小了。此外,支持M3D的SMO进一步改善了整个过程窗口。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号