THICK COPPER PCBA TECHNOLOGY PROCESS DEVELOPMENT

摘要

Soldering Plated Through Hole (PTH) components on thick multi-layers Print Circuit Boards (PCB) has always been a challenge in manufacturing for both manual and wave soldering processes, especially from a vertical solder hole fill aspect. With customer designs demanding thick copper inner layers to carry more electrical current, soldering becomes more challenging than ever. This paper evaluates and presents critical design variables in thick, heavy copper Print Circuit Board's (PCB) that help to improve PTH hole-fill for lead-free wave soldering process.