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Performance analysis of a silicon piezoresistive pressure sensor based on diaphragm geometry and piezoresistor dimensions

机译:基于膜片几何形状和压阻尺寸的硅压阻压力传感器性能分析

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Micro Electro Mechanical System (MEMS) based silicon pressure sensors were the first micro mechanical transducers developed. They have undergone a significant growth in the last few years. In this paper the different shapes of diaphragms (rectangular, square and circular) having the same surface area and thickness has been investigated. Performance parameters like the maximum induced stress and deflection of the diaphragms have been compared using the finite element tool Coventor Ware®. In addition to that, the effect of the size of the piezoresistor which forms the whetstone bridge of the sensor, on the sensitivity has been studied and reported. There are four resistors diffused in to the diaphragm in such a way that two of them are arranged parallel to the membrane edge (Group-A) and the other two are arranged perpendicular to the edge (Group-B). The simulation results clearly indicate that the dimension of Group-B resistor plays an important role in determining the sensitivity of the pressure sensor.
机译:基于微机电系统(MEMS)的硅压力传感器是最早开发的微机械传感器。在最近几年中,它们经历了显着的增长。本文研究了具有相同表面积和厚度的不同形状的膜片(矩形,正方形和圆形)。使用有限元工具CoventorWare®对性能参数(如最大感应应力和隔膜的挠度)进行了比较。除此之外,已经研究并报道了形成传感器的油石桥的压敏电阻的尺寸对灵敏度的影响。有四个电阻扩散到膜片中,使得两个电阻平行于膜边缘(A组),另外两个垂直于边缘(B组)。仿真结果清楚地表明,B组电阻器的尺寸在确定压力传感器的灵敏度方面起着重要作用。

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