首页> 外国专利> Silicon diaphragm piezoresistive pressure sensor and fabrication method of the same

Silicon diaphragm piezoresistive pressure sensor and fabrication method of the same

机译:硅膜压阻式压力传感器及其制造方法

摘要

A silicon diaphragm piezoresistive pressure sensor having a diaphragm formed by a single-sided fabrication method. The pressure sensor is made up of a substrate on which there is a diaphragm at or near the surface of the substrate with a chamber under the diaphragm. The pressure sensor is fabricated by undercutting a silicon substrate to form a diaphragm and a cavity within the bulk of the substrate under the diaphragm. The fabricating steps including a) forming a buried low resistive layer under a predetermined diaphragm region; b) converting the low resistance layer into porous silicon by anodization of silicon in a concentrated hydrofluoric acid solution; c) removing the porous silicon by selective etching; d) filling the openings formed in the etching of porous silicon with a deposited material to form a sealed reference chamber. Adding appropriate means to the exterior of the diaphragm and substrate to detect changes in pressure between the reference chamber and the surface of the substrate.
机译:一种具有通过单面制造方法形成的膜片的硅膜压阻式压力传感器。压力传感器由基板组成,在基板上或基板表面附近有隔膜,隔膜下方有腔室。通过对硅基板进行底切以形成隔膜和在隔膜下方的基板主体内的空腔来制造压力传感器。所述制造步骤包括:a)在预定的隔膜区域下方形成掩埋的低电阻层; b)通过在浓氢氟酸溶液中对硅进行阳极氧化,将低电阻层转化为多孔硅; c)通过选择性蚀刻去除多孔硅; d)用沉积的材料填充在蚀刻多孔硅中形成的开口,以形成密封的参考室。在膜片和基板的外部增加适当的装置,以检测参考腔室和基板表面之间的压力变化。

著录项

  • 公开/公告号US5242863A

    专利类型

  • 公开/公告日1993-09-07

    原文格式PDF

  • 申请/专利权人 XIANG-ZHENG;TU;YUN-YAN;LI;

    申请/专利号US19910830559

  • 发明设计人 LI YUN-YAN;TU XIANG-ZHENG;

    申请日1991-06-07

  • 分类号H01L21/465;

  • 国家 US

  • 入库时间 2022-08-22 04:57:48

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号