Novel packaging technologies for FPC-based optical transceiver for high-speed optical interconnect

摘要

We propose a high-speed FPC connector, an inductive peaking line on a module substrate, and an integrated lens using inkjet technology for a small-diameter photodiode to extend the frequency bandwidth on electrical and optical packaging. These techniques enable high-speed operation over 25 Gb/s. We fabricated a 4-channel flexible printed circuit-based optical engine by adopting these technologies and demonstrated a clear eye opening and error-free operation up to 41.25 Gb/s.