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Optical hybrid package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect

机译：光纤混合封装，带有8通道18GT / s CmOs收发器，用于芯片到芯片的光学互连

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J. Liaoa; A. Kerna; D. Luc; H. Braunischc; T. Thomasb; S. Hyvonena; S. Palermoa; I. A. Younga;
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年度 2015
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1. A Novel Bidirectional CMOS Transceiver for Chip-to-Chip Optical Interconnects [J] . Sae-Kyoung Kang, Tae-Woo Lee, David V. Plant, IEEE Photonics Technology Letters . 2006,第1期

机译：用于芯片间光互连的新型双向CMOS收发器
2. 2.5 Gbit/s multifunctional CMOS transceiver for chip-to-chip optical link [J] . Kang S.-K., Lee T.-W., Park H.-H. Electronics Letters . 2006,第7期

机译：2.5 Gbit / s多功能CMOS收发器，用于芯片到芯片的光链路
3. Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects [J] . Jamshid Sangirov, Ikechi Augustine Ukaegbu, Gulomjon Sangirov, Journal of Semiconductors . 2013,第12期

机译：半双工双向芯片到芯片光学互连的功耗感知收发器设计
4. Optical hybrid package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect [C] . E. Mohammed, J. Liao, A. Kern, Conference on Photonics Packaging, Integration, and Interconnects; 20080122-24; San Jose,CA(US) . 2008

机译：具有8通道18GT / s CMOS收发器的光学混合封装，用于芯片间的光学互连
5. Optomechanics and optical packaging for free-space optical interconnects. [D] . Boisset, Guillaume Charles Louis. 1998

机译：用于自由空间光学互连的光机械和光学封装。
6. Single-chip photonic transceiver based on bulk-silicon as a chip-level photonic I/O platform for optical interconnects [O] . Gyungock Kim, Hyundai Park, Jiho Joo, -1

机译：基于体硅的单芯片光子收发器作为用于光学互连的芯片级光子I / O平台
7. 1550nm Optical Interconnect Transceiver with Low Voltage Electroabsorption Modulators Flip-Chip Bonded to 90nm CMOS [O] . Jonathan E. Roth, Samuel Palermo, Noah C. Helman, 2015

机译：1550nm光互连收发器，带低压电吸收调制器倒装芯片，可粘接到90nm CmOs

Optical hybrid package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect

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