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Doping mechanism of helium-based plasma

机译:氦基等离子体的掺杂机理

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摘要

The mechanism of helium-based plasma doping (He-PD) was investigated. It is found out for the first time that the mechanism is that dopant atoms are knocked-on by a huge number of helium atoms, born out by the results of experiments of helium plasma irradiation following the ultra-low energy implantations. Boron and phosphorous atoms are knocked-on to the almost same depth. Arsenic ions are also evaluated and deeper depth doping than boron and phosphorous is observed. Additionally, it is not necessarily the case that the profile by the He-PD shows steeper abruptness than conventional ion implantation but it is limited to the low power condition. The moving distance by helium irradiation does not depend on atom mass but it correlates linearly to the atom radius. Large atoms such as arsenic moves more than smaller atoms like boron and phosphorous.
机译:研究了基于氦基等级掺杂(HE-PD)的机制。首次发现该机制是掺杂剂原子被大量的氦原子撞击,通过超低能量植入后通过氦等离子体辐射的实验结果出来的。硼和磷原子被撞到几乎相同的深度。还观察到砷离子,并且观察到比硼和磷的更深深度掺杂。另外,HE-PD的轮廓不一定的情况显示比传统的离子注入更陡峭的突然性,但它限于低功率状态。氦辐射的移动距离不依赖于原子质量,但它与原子半径线性地相关。诸如砷的大原子比硼和磷等较小的原子更多地移动。

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