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DETERMINATION OF CONTACT RESITANCE IN METAL-SEMICONDUCTOR STRUCTURE

机译:金属半导体结构中接触电阻的测定

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As is well known, the metal-semiconductor contact is a clearly component of any semiconductor device. At the same time, such contacts cannot be assumed to be as low resistance as that two connected meatls. In particular, a large mismatch between the Fermi energy of the metal and semiconductor can result is a high-resistance rectifying contact. A proper choice of materials can provide a low resistance ohmic contact. However for a lot of semiconductors there is no appropriate metal available. Instead one then creates a tunnel contact. Such contact consists of a thin barrier-obtained by heavily-doping the semiconductor-through which carriers can readily tunnel. Contact formation is also affected by thin interfacial layers and is typically finished off with a final anneal or alloy formation after the initial deposition of the metal In this paper, our work aims to describe each of these contacts; we end this study by determining the contact resistance between a metal and a thin semiconductor layer.
机译:众所周知,金属半导体触点是任何半导体器件的明显部件。同时,这种触点不能被认为是尽可能低的电阻。特别地,金属和半导体的费米能量之间的大不匹配可以产生高电阻整流接触。适当的材料选择可以提供低电阻欧姆接触。然而,对于许多半导体,没有适当的金属可用。而是一个人然后创建隧道联系人。这种触点由通过重掺杂载流子可以容易地隧道的半导体来实现的薄壁屏障组成。接触形成也受薄界面层的影响,并且在本文初始沉积金属后,通常在最终退火或合金形成后完成,我们的工作旨在描述这些联系人中的每一个;通过确定金属和薄半导体层之间的接触电阻,我们结束了本研究。

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