In this paper, CVD diamond films were planarized by thermal chemical mechanical polishing in two steps of optimized polishing methods (first polishing and final polishing). In the first polishing process, Al_2O_3 abrasives with particle size of 14μm were chosen to remove the rough surface of the diamond films. In the final polishing process, three kinds of polishing experiments containing different abrasives were compared. The experiment results demonstrated that the slurry with mixture abrasives and KMnO_4 oxidant at the high temperature can effectively improve the diamond films surface morphology. As a result, the surface roughness was reduced from 280nm to 27.2nm, and the removal rate was up to 1.21 μm /h.
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