首页> 外文会议>IEEE MTT-S International Microwave Symposium >A ka-band fully integrated transceiver multi-chip module based on aluminum nitride multi-layer LCC package with the waveguide interface
【24h】

A ka-band fully integrated transceiver multi-chip module based on aluminum nitride multi-layer LCC package with the waveguide interface

机译:基于氮化铝多层LCC封装的KA带全集成的收发器多芯片模块,带有波导接口

获取原文

摘要

A super miniaturized transceiver module whose size is 35mm×35mm×6mm has been successfully developed for LMDS (Local Multipoint Distribution System). The module that can be directly connected to an antenna consists of all of active circuits andthe frequency duplexer by using the newly developed drop-in circulator. An AlN multi-layer LCC package was employed for the package in consideration of transmission loss and thermal management. The saturated output power of 23dBm, the phase noise of9ldBc/Hz @100KHz off, and the receiver noise figure of 7.0dB are obtained at 30GHz band.
机译:为LMDS(本地多点分配系统)成功开发了一种超级小型化收发器模块,其尺寸为35mm×35mm×6mm。可以通过使用新开发的下载循环器来直接连接到天线的模块由所有活动电路和频率双工器组成。考虑到传输损耗和热管理,使用ALN多层LCC封装。在30GHz频段获得饱和输出功率,为9dBc / Hz @ 100khz的相位噪声和7.0db的接收器噪声系数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号