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Novel Silicon Surface Pre-Treatment (SSPT) Technique for CMOS Device Performance Boosting

机译:CMOS器件性能提升的新型硅表面预处理(SSPT)技术

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In this paper, a novel surface treatment technique using Silicon Surface Pre-Treatment (SSPT) technique to boost high performance CMOS circuit is reported. This approach provides a smooth silicon surface and extends the effective channel width to enhance device performance on both N and PMOSFET. In this work, a smooth and rounded active area (AA) surface was successfully fabricated. Using this technique, we demonstrated a significant device boost of 15% and 7% on small dimension N and PMOSFET, respectively. These achievements were demonstrated without negative impact on GOI and NBTI.
机译:本文报道了一种新的使用硅表面预处理(SSPT)技术来提升高性能CMOS电路的新型表面处理技术。该方法提供平滑的硅表面,并延伸有效的通道宽度,以增强N和PMOSFET上的装置性能。在这项工作中,成功制造了光滑和圆形的有源区(AA)表面。使用这种技术,我们分别证明了小维度N和PMOSFET的重要装置增加了15%和7%。这些成就被证明没有对GOI和NBTI产生负面影响。

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