Silicon on insulator CMOS and microelectromechanical systems: Mechanical devices, sensing techniques and system electronics.

摘要

The marriage of integrated circuits and microelectromechanical systems (MEMS) allows for the design of compact, low power, high performance sensing solutions. These devices are on the cutting edge of technology pushing the limits of fabrication and integration.; This thesis will present work on building MEMS devices and the supporting electronics needed to control, sense and output the information content of the MEMS device in Silicon-On-Insulator (SOI) CMOS processes. The majority of this work is performed in an SOI process available from Peregrine Semiconductor known as SOS. To our knowledge no other research has been performed using the SOS process to build CMOS MEMS, or to implement novel CMOS based optical transduction schemes.; The purpose of this thesis is to first, introduce the reader to MEMS devices and SOI/SOS CMOS processes. Second, present the groundwork needed for SOS MEMS design. Third, review MEMS transduction methods and present new CMOS based optical transduction methods. Fourth, review basic MEMS structures, properties and explain MEMS sensing solutions. Fifth, to present descriptions and testing of the electronics necessary to interface with MEMS devices. Sixth, present complete integrated MEMS systems. Lastly, to review pioneering work performed in a new 3D CMOS process which provides advantages for both CMOS MEMS and optical transduction.; The thesis will begin by introducing the reader to MEMS devices, SOI CMOS and SOS CMOS, giving them a basic understanding of each. It will then explain the specific advantages and disadvantages of building MEMS and integrated circuits in these types of processes. I will present a wide range of work performed to fabricate and characterize MEMS devices in SOI processes. I will present a new MEMS sensing method based on optical interferometry. I will review fabricated SOS MEMS devices and their functionality. I will review and show characterization of system components necessary to build a complete integrated sensor. Complete systems will be shown and test results presented. Lastly the results from a new 3D SOI CMOS process will be presented.