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Rotary Spatial Plasma Enhanced Atomic Layer Deposition — An enabling manufacturing technology for μm-thick ALD films

机译:旋转空间等离子体增强的原子层沉积 - 用于μm厚的ALD薄膜的能力制造技术

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Atomic Layer Deposition (ALD) is well known for its high film quality and high conformality, but limited by the low deposition rate. Beneq proposes a novel approach using Rotary Spatial Plasma Enhanced ALD process, which can reach deposition rates 10× higher than traditional pulsed ALD. This technology also enables use of PEALD in batch mode with high throughput. This paper describes the technology in more details.
机译:原子层沉积(ALD)以其高薄膜质量和高形象性众所周知,但受低沉积速率的限制。 BENEQ提出了一种使用旋转空间等离子体增强型ALD工艺的新方法,其可以达到比传统脉冲ALD高的沉积率10倍。该技术还通过高吞吐量实现了批量模式下的PEALD。本文更详细地描述了该技术。

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