A New CIS Packaging Process and Structure to Improve Die Chipping

摘要

The CIS product performs easily to receive customer complaints for a variety of screen issue. As a result, great effort was made by failure analysis team and found that the most of NG samples suffered die chipping during the module assessment. This paper presents a new CIS packaging process and structure which can effectively improve the film stress on the backside silicon of the CIS product, according to reduce the failure risk of the chip. The packaging process with the new structure has the character of simple craft and low cost as well as large-scale and roboticized production.