A Novel Die Sorter Based on Micro Tweezer for Terahertz Schottky Barrier Diodes

摘要

A novel die sorter based on mechanical gripper was developed for picking and placing diced terahertz Schottky barrier diodes (SBD). The designing and working principle of die sorter are based on flexible hinge and linear-actuator. Dimensions of dies gripped by the sorter can be as small as 100 µm * 50 µm* 15 µm without damage to its air-bridge. For flipping upside down dies, the rotation motion was obtained by rotating linear actuator about its shaft. It is demonstrated that the placement accuracy of the sorter can achieve less than 9.5 µm and 3.0 µm in x-y direction respectively.