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Optimization of Imperfect Morphology for Selective Epitaxial Sige Growth

机译:优化选择性外延SiGe生长的不完美形态

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With advanced devices continuously scaling down, embedded SiGe in source and drain regions has been demonstrated to improve p-MOSFET device performance through hole mobility enhancement. However, as germanium and in-situ boron concentrations are required to increase simultaneously, the pattern loading effect of selective epitaxial growth of SiGe:B in recess sigma structure is enhanced after processes. Compared with logical areas, the SRAM areas show the imperfect morphology of SiGe:B growth, which becomes the major killer of the yield. In this paper, we investigate the effect of annealed SiN films as hard-mask layer and films of various thicknesses on the formation of SiGe growth in recess sigma structure. The formation mechanism of the imperfect morphology is analyzed, and the selective epitaxial SiGe growth is optimized to improve electrical properties.
机译:利用先进的设备持续缩放,已经证明了源极和漏极区域中的嵌入式SiGe,以通过空穴移动增强来改善P-MOSFET器件性能。然而,随着锗和原位硼浓度的同时需要增加,在工艺之后提高了休息SiGMA结构中SiGe:B的选择性外延生长的模式加载效果。与逻辑领域相比,SRAM领域展示了SiGe:B生长的不完美形态,成为产量的主要杀伤者。在本文中,我们研究了退火的SIN膜作为凹陷SiGMA结构中SiGe生长的各种厚度的硬掩模层和薄膜的影响。分析了不完美形态的形成机制,并优化了选择性外延SiGe生长以改善电性能。

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