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Breakdown Voltage Limitations, Impact Ionization, and Interband Tunneling in InP/GaAsSb/InP Type-II NpN DHBTs

机译:击穿电压限制,碰撞电离和INP / GAASSB / INP类型II NPN DHBT中的间带隧穿

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We investigate the breakdown limitations of staggered ("type-II") lineup InP/GaAsSb/InP N-p-N double hetero-junction bipolar transistors (DHBTs). These devices generally feature an abnormally low open-emitter BV{sub}(CBO) despite the low electron impact ionization coefficient for electrons in the InP collector layer. We show that the high apparent BV{sub}(CEO)/BV{sub}(CBO) ratio can be associated with the onset of interband (Zener) tunneling across the narrow energy gap interface layer arising from the staggered band alignment at the reverse biased GaAsSb-InP base-collector hetero-junction. We also demonstrate that InP/GaAsSb DHBTs can be operated above BV{sub}(CEO) (and the apparent BV{sub}(CBO)), and UP to voltages approaching the impact ionization limited BV{sub}(CBO).
机译:我们研究了交错(“II”)阵容InP / Gaassb / InP N-P-N双杂连接双极晶体管(DHBT)的击穿限制。这些器件通常具有异常低开口发射器BV {Sub}(CBO),尽管InP集电极层中的电子电离子系数低电电离系数。我们表明高表观BV {SUB}(CEO)/ BV {SUB}(CBO)比率可以与横跨窄的带间隙界面层的间带(齐纳)隧道的开始关联,窄能量间隙界面层逆转偏置的GAASSB-INP基础收集器杂连接。我们还证明了INP / GAASSB DHBTS可以在BV {SUB}(CEO)上方操作(以及表观BV {SUB}(CBO)),并且最多达到接近冲击电离限制BV {SUB}(CBO)的电压。

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