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Research on the h-BN Films for High Frequency SAW Devices

机译:高频声表面波器件的h-BN薄膜研究

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Hexagonal Boron Nitride (h-BN) films For high-frequency SAW devices were deposited on Ti/Al/Si(111) wafers by RF magnetron sputtering. The structure of h-BN films was investigated by fourier transform infrared (FTIR) spectroscopy and X-ray diffraction (XRD) spectra. And the surface morphology and piezoelectric properties of h-BN film was characterized by atomic force microscopy (AFM). And the characterization results show that when the RF power is 300w and other experimental parameters were fixed, h-BN films was in high purity and the c-axis oriented, h-BN films was in high purity and the c-axis oriented, and the particles of which are uniform and compact, roughness is 2.63nm with piezoelectric and piezoelectric response even, meet the requirements of high sound propagation speed and excellent piezoelectric for high frequency SAW devices. The studies of piezoelectric test of thin films have shown that PFM test method of atomic force microscopy was suitable for characterization of piezoelectric and properties of the piezoelectric response distribution of nano-structure semiconductor thin film.
机译:六方氮化硼(h-BN)膜用于高频声表面波器件,是通过RF磁控溅射在Ti / Al / Si(111)晶片上沉积的。 h-BN薄膜的结构通过傅立叶变换红外(FTIR)光谱和X射线衍射(XRD)光谱进行了研究。用原子力显微镜(AFM)对h-BN薄膜的表面形貌和压电性能进行了表征。表征结果表明,当射频功率为300w且固定其他实验参数时,h-BN薄膜为高纯度且c轴取向,h-BN薄膜为高纯度且c轴取向,其颗粒均匀致密,粗糙度为2.63nm,具有压电和压电响应,满足高频声表面波器件的高声传播速度和优良压电的要求。薄膜压电测试的研究表明,原子力显微镜的PFM测试方法适用于表征纳米结构半导体薄膜的压电特性和压电响应分布的性质。

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