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ELECTRO-THERMAL ANALYSIS AND MONTE CARLO SIMULATION FOR THERMAL ISSUE IN SI DEVICES

机译:SI设备中热问题的电热分析和蒙特卡洛模拟

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Nowadays, precise prediction of the heat generation in semiconductor devices is significant. Electro-thermal analysis is one of the attractive methods to predict the heat generation in devices. However, in electro-thermal analysis, the relaxation time approximation is applied to calculate the scattering term in momentum and energy conservation equation. And the assumption of the constant relaxation time for the scattering term of energy conservation equation and the momentum relaxation time derived from the empirical carrier mobility are conventionally applied. For precise prediction of the relaxation times, Monte Carlo (MC) simulation can be applied. In this research, we consider the importance of these relaxation times for heat generation in semiconductor devices. We compare the results with conventional relaxation times and those with the relaxation time from MC simulation in electro-thermal analysis. The calculation results show the electro-thermal analysis with the conventional relaxation time model will overestimate the heat generation densityin lower electric field of devices and in higher clock frequency devices.
机译:如今,精确预测半导体器件中的热量非常重要。电热分析是预测设备中热量产生的有吸引力的方法之一。然而,在电热分析中,应用弛豫时间近似来计算动量和能量守恒方程中的散射项。并且,通常采用能量守恒方程的散射项的恒定弛豫时间和由经验载流子迁移率导出的动量弛豫时间的假设。为了精确地预测弛豫时间,可以应用蒙特卡洛(MC)仿真。在这项研究中,我们考虑了这些弛豫时间对半导体器件中热量产生的重要性。我们将结果与常规弛豫时间进行了比较,并将其与电热分析中的MC模拟得出的弛豫时间进行了比较。计算结果表明,采用常规弛豫时间模型进行的电热分析会高估热量产生的密度。 在较低的设备电场和较高的时钟频率设备中。

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