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Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques

机译:大型BGA组件的振动测试耐久性:增强技术评估

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The paper describes experimental and finite element modelling (FEM) analyses on BGA assemblies under vibration tests. The purpose is to evaluate reinforcement methods of large BGA submitted to vibrations. Two techniques are used in this test: a cord of glue around the BGA (‘peel off joint’), and gluing all the ball matrix of the second level of the BGA (Underfilling). Comparison between SnPb and SAC alloy is also done. In all cases, failures mechanisms and Time To Failure (TTF) are compared. Failure analysis permits to follow the change in microstructure when solder balls are submitted to mechanical loading.
机译:本文介绍了在振动测试下对BGA组件进行的实验和有限元建模(FEM)分析。目的是评估承受振动的大型BGA的加固方法。此测试中使用了两种技术:在BGA上绕一圈胶水(“剥离接头”),以及将BGA第二级的所有球基胶合(未填充)。还对SnPb和SAC合金进行了比较。在所有情况下,都将比较故障机制和故障时间(TTF)。当焊球承受机械载荷时,故障分析允许跟踪微观结构的变化。

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