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TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
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机译:使用探测技术测试BGA和其他CSP封装
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AbstractA method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.Fig. 4
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