Study on the reliability of high power device assemblies using high-Pb solder alternatives: an overview

摘要

This paper gives a comprehensive overview of literature data on the reliability of different alternative Pb-free assembly technologies for high temperature applications with 4 groups of materials: SAC based solder alloys, Silver filled epoxies, Eutectic AuSn solder and a thermal interface material. For each group, the typical degradation models and mechanism of different material compositions in the high temperature applications will be overviewed, and accelerated test results with different test modules will be summarized. Approaches to predict the expected damage in the field, developed and being developed accelerated life models for certain type of applications will be given as well. In addition, the potential and the challenges to switch to these high Pb alternatives and to predict their reliability will be discussed. This overview provides guidance to potential users of assemblies for high power applications for selecting a proper reliable Pb-free alternative assembly method.