为提高高功率半导体激光器封装质量,对AuSn焊料预热温度进行研究.通过分析AuSn焊料共晶原理,建立四组不同预热温度的AuSn焊料封装试验.通过对比不同预热温度下封装器件的光电参数,光谱特性及SEM检测效果,对实验结果进行分析.实验结果表明AuSn焊料的预热温度对高功率半导体激光器封装质量有重要影响,并得出AuSn焊料预热温度在235℃时高功率半导体激光器的封装质量最为理想.%In order to improve the packaging quality of high power semiconductor laser, the preheating temperature of AuSn solder was studied. By analyzing the eutectic principle of AuSn solder,four groups of AuSn solder packaging ex-periment with different preheating temperatures were established. The experimental results were verified by comparing the photoelectric parameters,the spectral characteristics and the SEM detection results of the packaged devices with dif-ferent preheating temperature. The experimental results show that the preheating temperature of AuSn solder had an im-portant influence on the quality of high power semiconductor laser packaging,and it was concluded that the AuSn sol-der preheating temperature at 235℃ packaging quality of high power semiconductor lasers was the most ideal.
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