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On the radiation-induced soft error performance of hardened sequential elements in advanced bulk CMOS technologies

机译:先进的块状CMOS技术中硬化顺序元素的辐射诱发的软错误性能

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Test chips built in a 32nm bulk CMOS technology consisting of hardened and non-hardened sequential elements have been exposed to neutrons, protons, alpha-particles and heavy ions. The radiation robustness of two types of circuit-level soft error mitigation techniques has been tested: 1) SEUT (Single Event Upset Tolerant), an interlocked, redundant state technique, and 2) a novel hardening technique referred to as RCC (Reinforcing Charge Collection). This work summarizes the measured soft error rate benefits and design tradeoffs involved in the implemented hardening techniques.
机译:由32纳米体CMOS技术构建的测试芯片由硬化和未硬化的顺序元素组成,已经暴露于中子,质子,α粒子和重离子中。两种类型的电路级软错误减轻技术的辐射的鲁棒性进行了测试:1)SEUT(单粒子翻转容错),一个互锁,冗余状态的技术,以及2)一种新的硬化技术称为RCC(增强电荷收集)。这项工作总结了已实施的加固技术中所测得的软错误率收益和设计折衷。

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