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Evolution of Structural and Electronic Properties in Boron-doped NanocrystallineSilicon Thin Films

机译:掺硼纳米硅薄膜的结构和电子性能的演变

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We report on the boron-doping dependence of the structural and electronic properties in nanocrystalline silicon (nc-Si:H) films directly deposited by plasmaenhanced chemical vapor deposition (PECVD). The crystallinity, micro-structure, and dark conductivity (σ_d) of the films were investigated by gradually varying a ratio of trimethylboron [B(CH_3)_3 or TMB] to silane (SiH_4) from 0.1 to 2 %. It was found that the low level of boron doping (≤ 0.2 %) first compensated the nc-Si:H material which demonstrates slightly n-type properties. As the doping increased up to 0.5 %, the maximum σ_d of 1.11 S/cm was obtained while high crystalline fraction (X_c) of the films (over 70 %) was maintained. However, further increase in the TMB-to-SiH4 ratio reduced σd to the order of 10~-7 S/cm due to a phase transition of the films from nanocrystalline to amorphous, which was indicated by Raman spectra measurements. P-channel nc-Si:H thin film transistors (TFTs) with top gate and staggered source/drain contacts were fabricated using the developed p~+ nc-Si:H layer. The fabricated TFT exhibits a threshold voltage (V_Tp) of -26.2 V and field effective mobility of holes (μp) of 0.24 cm~2/V•s.
机译:我们报告了通过等离子增强化学气相沉积(PECVD)直接沉积的纳米晶体硅(nc-Si:H)膜中结构和电子性能对硼掺杂的依赖性。通过逐渐将三甲基硼[B(CH_3)_3或TMB]与硅烷(SiH_4)的比例从0.1%更改为2%,研究了薄膜的结晶度,微观结构和暗电导率(σ_d)。已经发现,低水平的硼掺杂(≤0.2%)首先补偿了nc-Si:H材料,该材料显示出轻微的n型特性。当掺杂增加到0.5%时,最大的σ_d为1.11 S / cm,同时保持了薄膜的高结晶分数(X_c)(超过70%)。然而,由于薄膜从纳米晶体到非晶态的相变,TMB与SiH4之比的进一步增加将σd降低至10〜-7 S / cm的量级,这通过拉曼光谱测量表明。 使用已开发的p〜+ nc-Si:H层制造了具有顶栅和交错的源极/漏极触点的P沟道nc-Si:H薄膜晶体管(TFT)。制成的TFT的阈值电压(V_Tp)为-26.2 V,空穴的场有效迁移率(μp)为0.24 cm〜2 / V•s。

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