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Fluxless Wafer-to-Wafer Bonding in Vacuum Using Electroplated Sn-Rich Sn-Ag Dual-layer Structure

机译：真空镀锡富锡锡银双层结构的无焊剂晶圆间键合

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th 》|2006年|P.1290-1293|共4页
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Wang P.J.; Kim J.S.; Lee C.C.;
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1. Fluxless Sn-Ag bonding in vacuum using electroplated layers [J] . Jongsung Kim, Chin C. Lee Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2007 ,第1a2期

机译：使用电镀层在真空中进行无助焊剂Sn-Ag键合
2. Fluxless wafer bonding with Sn-rich Sn-Au dual-layer structure [J] . Jongsung Kim, Chin C. Lee Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2006 ,第1a2期

机译：富锡Sn-Au双层结构的无助焊剂晶圆键合
3. Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures [J] . Jongsung Kim, Dongwook Kim, Chin C. Lee IEEE Transactions on Advanced Packaging . 2006 ,第3期

机译：电镀锡富锡锡金结构的无助焊剂倒装芯片焊点制造
4. Fluxless Wafer-to-Wafer Bonding in Vacuum Using Electroplated Sn-Rich Sn-Ag Dual-layer Structure [C] . Wang P.J., Kim J.S., Lee C.C. Electronic Components and Technology Conference . 2006

机译：使用电镀SN的SN-AG双层结构真空无芯晶片到晶片键合
5. Fluxless bonding technology using electroplated multilayer solder structures [D] . Kim, Jongsung 2007

机译：使用电镀多层焊料结构的无助焊技术
6. Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding [O] . Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, 2020

机译：金膜厚度和表面粗糙度对室温晶圆键合和金-金表面活化键合的晶圆级真空密封的影响
7. Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures [O] . Pin J. Wang, Jong S. Kim, Chin C. Lee 2009

机译：使用电镀共晶Au / Sn / Au结构将大硅芯片无助焊剂粘结到陶瓷封装上

Fluxless Wafer-to-Wafer Bonding in Vacuum Using Electroplated Sn-Rich Sn-Ag Dual-layer Structure

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