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High Temperature Aging Study of Intermetallic Compound Formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu Solders on Electroless Ni (P) Metallization

机译：化学镀Ni（P）上Sn-3.5Ag和Sn-4.0Ag-0.5Cu焊料金属间化合物形成的高温时效研究

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1468-1475|共8页
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Peng Sun; Andersson C.; Xicheng Wei; Zhaonian Cheng; Zonghe Lai; Dongkai Shangguan; Liu J.;
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3. High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization [J] . P. Sun, C. Andersson, X. Wei Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2006,第1a2期

机译：化学镀Ni（P）上Sn-3.5Ag和Sn-4.0Ag-0.5Cu焊料金属间化合物形成的高温时效研究
4. Effect of Morphological Change of Ni3Sn4 Intermetallic Compounds on the Growth Kinetics in Electroless Ni-P/Sn-3.5Ag Solder Joint [J] . Sohn Yoonchul Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science . 2020,第6期

机译：Ni3Sn4金属间化合物形态变化对化学镀Ni-P / Sn-3.5AG焊点生长动力学的影响
5. Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy [J] . Dong Min Jang, Jin Yu Journal of Materials Research . 2011,第24期

机译：三元化学镀镍凸块冶金上Sn-3.5Ag焊料的金属间化合物剥落特性
6. High Temperature Aging Study of Intermetallic Compound Formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu Solders on Electroless Ni (P) Metallization [C] . Peng Sun, Andersson C., Xicheng Wei, Electronic Components and Technology Conference . 2006

机译：SN-3.5AG金属间化合物形成的高温老化研究，无电气化合物 - 4.0AG-0.5CU焊料（P）金属化
7. First-principles point defect models in Zr7Ni10 and Zr2Ni7 binary intermetallic compounds and their implications in nickel-metal hydride batteries. [D] . Wong, Diana F. 2015

机译：Zr7Ni10和Zr2Ni7二元金属间化合物的第一性原理点缺陷模型及其在镍氢电池中的意义。
8. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
9. Soldering-Induced Cu Diffusion and Intermetallic Compound Formation between Ni/Cu Under Bump Metallization and SnPb Flip-Chip Solder Bumps [O] . Huang Chien-Sheng 2011

机译：凸点金属化和SnPb倒装芯片凸点下镍/铜之间的锡基铜扩散和金属间化合物形成
10. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging [R] . Minor, A. M. , Morris, J. W. 1999

机译：老化后在焊料 - 基板界面上生长au-Ni-sn金属间化合物

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