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Study of Low-modulus Die Attach Adhesives and Molding Componds on Warpage and Damage of PBGA

机译：低模压固模胶和模塑化合物对PBGA翘曲和损伤的研究

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.939-945|共7页
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Sung Yi; Daharwal; P.D.; Lee; Y.J.; Harkness; B.R.;
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1. Correction to "high-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles" [J] . Varyiyam M., Sundararaman V. IEEE transactions on electronics packaging manufacturing . 2000,第2期

机译：对“用于硅和氧化铝砖的大面积薄膜加工的高温，低模量粘合剂附着”的更正
2. High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles [J] . Variyam M., Sundararaman V. IEEE transactions on electronics packaging manufacturing . 1999,第4期

机译：高温，低模量粘合剂，可在硅和氧化铝砖上进行大面积薄膜加工
3. Parametric study of warpage in PBGA packages [J] . The International Journal of Advanced Manufacturing Technology . 2020,第9a10期

机译：PBGA包装中翘曲的参数研究
4. Study of Low-modulus Die Attach Adhesives and Molding Componds on Warpage and Damage of PBGA [C] . Sung Yi, Daharwal P.D., Lee Y.J., Electronic Components and Technology Conference . 2006

机译：低模量模具附着粘合剂和模塑化合物对PBGA的翘曲和损伤
5. Comparative Study of Die Attach Adhesives Used in Stacked Die Configurations Using Three-point Bend Test [D] . Korad, Ankita Sanjiv. 2019

机译：用三点弯曲试验对模具附着粘合剂的模具粘合剂
6. Improved Method of Enumeration of Attached Bacteria for Study of Fluctuation in the Abundance of Attached and Free-Living Bacteria in Response to Diel Variation in Seawater Turbidity [O] . Won Bae Yoon, Reinhardt A. Rosson 1990

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7. A Study on Optimal Layout Design of Cooling Channels for Plastic Injection Molding Die : Optimal Layout Design Based on Evaluation of Warpage and Molding Time(Machine Elements, Design and Manufacturing) [O] . Tadayoshi MATSUMORI, Koetsu YAMAZAKI, Yoshiki DOI 2009

机译：塑料注塑模具冷却通道最优布局设计研究：基于翘曲和模制时间评估的最优布局设计（机器元件，设计和制造）

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