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Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles

机译：包括微型循环在内的动力循环中SnPb和SnAgCu焊点的现场条件可靠性评估

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.899-905|共7页
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Min Pei; Xuejun Fan; Bhatti P.K.;
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1. 低温下SnAgCu−SnPb混装焊点断裂模式演变规律 [J] . 吴鸣, 王善林, 孙文君, 中国有色金属学报（英文版） . 2021,第009期
2. 低温下SnAgCu−SnPb混装焊点断裂模式演变规律 [J] . 吴鸣, 王善林, 孙文君, 中国有色金属学报：英文版 . 2021,第009期
3. Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages [J] . Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Microelectronics & Reliability . 2007,第2a3期

机译：SnAgCu和SnPb焊点的热循环可靠性：几种IC封装的比较
4. Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints [J] . Borgesen P., Meilunas M. Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第8期

机译：焊膏量和回流曲线对SnAgCu / SnPb混合焊点热循环性能的影响
5. Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling [J] . Chen Jibing, Yin Yanfang, Ye Jianping, Soldering & Surface Mount Technology . 2015,第2期

机译：快速热循环研究单SnAgCu / SnPb焊点的疲劳行为
6. Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles [C] . Min Pei, Xuejun Fan, Bhatti P.K. Electronic Components and Technology Conference . 2006

机译：SNPB和SNAGCU焊点在电力循环中的现场条件可靠性评估，包括迷你循环
7. Plastic ball grid array (PBGA) solder joint reliability assessment under combined thermal cycling and vibration loading conditions [D] . Qi, Haiyu 2006

机译：结合热循环和振动载荷条件下的塑料球栅阵列（PBGA）焊点可靠性评估
8. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data [O] . Jinhua Mi, Yan-Feng Li, Yuan-Jian Yang, -1

机译：使用I型删失数据预测Sn-3.0Ag-0.5Cu焊点的热循环寿命
9. Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling [O] . Da Yu, Hohyung Lee, Seungbae Park 2016

机译：热循环下预载焊点的可靠性评估

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