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A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects

机译：基于应变范围的无铅SAC焊料互连寿命评估模型

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.884-890|共7页
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Osterman M.; Dasgupta A.; Han B.;
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4. A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects [C] . Osterman M., Dasgupta A., Bongtae Han Electronic Components and Technology Conference . 2006

机译：基于应变范围的PB无铅囊焊料互连的寿命评估模型
5. Study of the use of the Weibull distribution and compliance of the reliability of lead-free solder in accelerated thermal cycling through varying solder volume, pitch, and thermal range with previously established materials models. [D] . Berger, Barry Nathaniel. 2012

机译：使用先前建立的材料模型，通过改变焊料量，间距和热范围，研究威布尔分布的使用以及无铅焊料在加速热循环中的可靠性是否符合要求。
6. Erratum for La Rosa et al. In Vivo Assessment of Growth and Virulence Gene Expression during Commensal and Pathogenic Lifestyles of luxABCDE-Tagged Enterococcus faecalis Strains in Murine Gastrointestinal and Intravenous Infection Models [O] . Sabina Leanti La Rosa, Pat G. Casey, Colin Hill, 2015

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