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Chip assembly

机译:芯片组装

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摘要

Design teams designing modern multi-million gate systems-on-chip (SoCs) are being adversely affected by the lack of desired chip assembly solutions in addition to the challenges due to variability in nanometer technologies. Abstractions, bad pin assignments, incorrect block budgets, incorrect clock insertion delay budgets, lack of variability aware analysis engines, and lack of concurrent optimization capabilities often lead to chip failures, reduced yield, missed schedule and lost performance.Due to the late surprises in chip assembly, design teams have rushed to incorporate chip assembly as part of concurrent engineering with the block implementation. A new paradigm and tool set that enables efficient multi-million gate chip assembly while concurrently analyzing and optimizing across all variability scenarios is critical for nanometer hierarchical flows.In this paper we will review chip assembly challenges and discuss the requirements of an implementation system that comprehensively addresses all the issues.
机译:除了由于纳米技术的可变性带来的挑战之外,缺乏所需的芯片组装解决方案的同时,设计现代数百万门片上系统(SoC)的设计团队也受到不利影响。抽象,不良的引脚分配,不正确的块预算,不正确的时钟插入延迟预算,缺乏可变性感知分析引擎以及缺乏并行优化功能通常会导致芯片故障,降低良率,错过计划并损失性能。芯片组装方面,设计团队急于将芯片组装纳入与模块实现并行的工程中。一个新的范例和工具集可以实现数百万个门芯片的高效组装,同时跨所有可变性场景进行分析和优化,这对于纳米级分层流程至关重要。在本文中,我们将回顾芯片组装方面的挑战,并全面讨论实现系统的要求解决所有问题。

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