ULTRAHIGH-THERMAL-CONDUCTIVITY THERMAL MANAGEMENTMATERIALS FOR POWER ELECTRONICS

摘要

Thermal management problems are now critical in microelectronic and optoelectronicpackaging. In response to the serious limitations of traditional packaging materials, materialsuppliers are developing an increasing number of new thermal management materials with lowcoefficients of thermal expansion (CTEs), ultrahigh thermal conductivities, and low densities.There are now over a dozen low-CTE materials with thermal conductivities between that ofcopper (400 W/m-K) and four times that of copper (1600 W/m-K), several of which are beingused in an increasing number of commercial production applications. In addition, thermallyconductive carbon fibers are being used to reduce the CTEs and increase the thermalconductivities of printed circuit boards. These materials greatly expand the options of thepackaging engineer. This paper provides an overview of the state of the art of advancedpackaging materials, including their key properties, state of maturity, applications,manufacturing and cost. We also look at likely future directions, including nanocomposites.