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Formation of very fine pit and dot arrays using EB writing for ultrahigh density storage toward 1 Tb/in2

机译:使用EB写入形成非常精细的凹点和点阵列,以超高密度存储达到1 Tb / in 2

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Fabrication of ultrahigh packed pit and dot arrays have been studied using conventional electron beam (EB) writing, and positive and negative EB resists, ZEP520 and calixarene, respectively. Using fine electron beam with high probe current and very thinner resists, we demonstrate that the negative resist has a potential to achieve an ultrahigh density storage with both bit pitch (BP) and track pitch (TP) of <30 nm and a dot diameter of <15 nm, although the positive resist has a limitation at a BP of 60nm and a TP of 40nm. This dot array opens a way toward >1 trillion bits per inch2(Tb/in2) storage technology.
机译:已经研究了使用常规电子束(EB)写入,正负EB抗蚀剂ZEP520和杯芳烃分别制备超高堆积凹坑和点阵列的方法。使用具有高探测电流和非常薄的抗蚀剂的细电子束,我们证明负抗蚀剂具有实现<30 nm的位距(BP)和走线间距(TP)以及点直径均小于30nm的超高密度存储的潜力。 <15 nm,尽管正性抗蚀剂在BP为60nm和TP为40nm时有限制。这种点阵为通向每英寸 2 (Tb / in 2 )存储技术提供了一种途径。

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