首页> 外文会议>Reliability Physics Symposium Proceedings, 2004. 42nd Annual >Dynamic positive bias temperature instability characteristics of ultra-thin HfO2 NMOSFET
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Dynamic positive bias temperature instability characteristics of ultra-thin HfO2 NMOSFET

机译:超薄HfO 2 NMOSFET的动态正偏置温度不稳定性

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We present the threshold voltage instability characteristics of high-k HfO2 NMOSFET dielectric with SiON interface layer under dynamic stress. Compared to DC stress, reduced threshold voltage shift was observed at higher frequency and lower duty cycle in AC unipolar stress. Similarly, the degradation of maximum transconductance was also reduced with AC stress conditions. However, the degradation in subthreshold swing was found to be negligible and fairly independent of stress frequencies and duty cycles in AC unipolar stress. The traps in bulk of HfO2 dielectric, which is proportional to its physical thickness, is believed as the primary factor for larger threshold voltage shift as the thickness of HfO2 increases. Compared to the result under DC constant voltage stress, AC unipolar stress allows higher 10-year lifetime operating voltage.
机译:介绍了动态应力下具有SiON界面层的高k HfO 2 NMOSFET电介质的阈值电压不稳定性特征。与直流应力相比,交流单极应力在较高的频率和较低的占空比下观察到阈值电压偏移降低。同样,在交流应力条件下,最大跨导性能的降低也得到了降低。但是,发现亚阈值摆幅的降级可以忽略不计,并且与交流单极应力中的应力频率和占空比完全无关。与HfO 2 的电介质厚度成正比的HfO 2 电介质的陷阱被认为是随着HfO 2 厚度的增加而产生较大阈值电压偏移的主要因素。与直流恒定电压应力下的结果相比,交流单极性应力允许更高的10年寿命工作电压。

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