aluminium compounds; gallium compounds; semiconductor heterojunctions; titanium; aluminium; nickel; gold; platinum; ohmic contacts; contact resistance; annealing; Ti/Al/Ni/Au; Ti/Al/Pt/Au multi-layer Ohmic contacts; unintentionally-doped Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures; specific contact resistivities; diffusion; higher contact resistivity; metal electrode; carrier channel; Ti-Al-Ni-Au; Ti-Al-Pt-Au; Al/sub x/Ga/sub 1-x/N-GaN;
机译:Ti / Al / Pt / Au金属多层在n-Al_xGa_(1-x)N / GaN异质结构上的欧姆接触和界面反应
机译:Ti / Au,Ti / Al / Au和Ti / Al / Ni / Au与n-GaN的欧姆接触的研究
机译:Ti / Al / Ti / W无金欧姆接触通过预欧姆凹槽蚀刻和低温退火与AlGaN / GaN异质结构的机理
机译:Al / sub X / Ga / sub 1-x / n / gaN异质结构上的Ti / Al / Ni / Au和Ti / Al / Pt / Au多层欧姆触点
机译:Ti-Ni-Au形状记忆合金的结构与性能
机译:AlGaN / GaN HEMT的优化Ti / Al / Ta / Au欧姆接触的电学表征和纳米级表面形貌
机译:TA / Ti / Al / Ni / Au欧姆接触到AlGaN / GaN异质结构场效应晶体管的研究