首页> 外文会议>High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on >Microsystem manufacturing, assembly and packaging technology in Display-Card/spl trade/ applications
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Microsystem manufacturing, assembly and packaging technology in Display-Card/spl trade/ applications

机译:显示卡/ spl贸易/应用中的微系统制造,组装和包装技术

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The SWECARD Display-Card/spl trade/ has the same dimensions as a standard credit card, yet also features a display and buttons that make it possible to view stored information. The applications are endless: airline tickets, bankcards, loyalty cards, health cards and security/ID cards. Because of the size of the card, the microsystems manufacturing, assembly and packaging technology is extremely important to ensure a successful mass production. During the development of the cards and two small-scale productions, we encountered problems such as short circuit, misalignment, leakage, etc. However, these proved to be solvable with adjustments in our technology. This paper will address all the issues in this area and shed light on new ideas in the future R&D work.
机译:SWECARD显示卡/ spl trade /具有与标准信用卡相同的尺寸,但还具有显示屏和按钮,可以查看存储的信息。应用程序无穷无尽:机票,银行卡,会员卡,健康卡和安全/身份证。由于卡的大小,微系统的制造,组装和包装技术对于确保成功进行批量生产至关重要。在卡的开发和两个小规模生产过程中,我们遇到了短路,未对准,泄漏等问题。但是,事实证明,通过调整技术可以解决这些问题。本文将解决该领域中的所有问题,并为将来的研发工作提供新的思路。

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