首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >Ultra-low thermal budget CMOS process for 65nm-node low-operation-power applications
【24h】

Ultra-low thermal budget CMOS process for 65nm-node low-operation-power applications

机译:适用于65nm节点低工作功率应用的超低热预算CMOS工艺

获取原文

摘要

This paper describes the fabrication process and the performance of 65 nm-node CMOS transistors which have ultra-shallow junctions. Flash lamp annealing enhances the drivability of pFETs with a solid phase epitaxial extension junction. The increase in the junction leakage of the extension junction is less than 1 order of magnitude as compared with that for the conventional spike RTA on a 300 mm/spl phi/ wafer. Excellent Vth control at 35 nm gate length without halo implantation and a high switching speed at 0.9 V power supply are demonstrated for 65 nm-node LOP (low operation power) applications.
机译:本文介绍了具有超浅结的65nm节点CMOS晶体管的制造过程和性能。闪光灯退火增强了具有固相外延延伸结的PFET的驱动性。与300mm / SPL PHI /晶片上的传统尖峰RTA相比,延伸结的结漏的结漏的结额小于1级。在没有晕圈注入的情况下,在35nm栅极长度下的优异vth控制和0.9 V电源的高开关速度被证明为65 nm节点延迟(低运行电源)应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号