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Method for forming super-steep retrograded channel (SSRC) for cmos transistor using rapid laser annealing to reduce thermal budget

机译:利用快速激光退火以降低热收支的cmos晶体管形成超陡倒退沟道的方法

摘要

A method for making a ULSI MOSFET chip includes forming a sacrificial gate on a substrate along with activated source and drain regions, but without initially establishing a doped channel region. The polysilicon portion of the sacrificial gate is then removed and a neutral ion species such as Silicon or Germanium is implanted between the source and drain regions in the region that is to become the doped channel region. A dopant substance is next implanted into the channel region, which is then exposed to ultra-rapid thermal annealing to cause the dopant to form a box-like, super-steep retrograded channel profile. The gate is then re-formed over the now activated doped channel region.
机译:一种用于制造ULSI MOSFET芯片的方法,该方法包括在衬底上与被激活的源极和漏极区域一起形成牺牲栅极,但是首先不建立掺杂沟道区域。然后去除牺牲栅极的多晶硅部分,并且在将成为掺杂沟道区的区域中的源极区和漏极区之间注入诸如硅或锗的中性离子物质。接下来将掺杂剂物质注入到沟道区中,然后将其暴露于超快速热退火中,以使掺杂剂形成盒状,超陡峭的逆行沟道轮廓。然后在现在激活的掺杂沟道区上重新形成栅极。

著录项

  • 公开/公告号US2001014495A1

    专利类型

  • 公开/公告日2001-08-16

    原文格式PDF

  • 申请/专利权人 YU BIN;

    申请/专利号US20010764632

  • 发明设计人 BIN YU;

    申请日2001-01-17

  • 分类号H01L21/338;H01L21/8238;H01L21/8236;H01L21/336;H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;

  • 国家 US

  • 入库时间 2022-08-22 01:07:17

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