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Compact BJT-Based Thermal Sensor for Processor Applications in a 14 nm tri-Gate CMOS Process

机译:基于紧凑型BJT的热传感器,用于14 nm三门CMOS工艺的处理器应用

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摘要

Compact thermal sensors (< 0.02 mm 2 ) are important for measuring thermal gradients in microprocessors and can directly affect the processors performance and power management. In this paper, the first 14 nm thermal sensor is reported. This sensor was fabricated in Intel's 14 nm process, and is one of the first analog circuits reported in this technology. It has an area of 0.0087 mm 2 , can sense at a speed > 50 kS/sec, consumes 1.1 mW with a resolution of 0.5 °C, and has a resolution FOM of 5.7 nJ C 2 . It is very close to the present BJT sensor state-of-the-art in its size, while being much faster and having a much better FOM than any of the compact BJT sensors.
机译:紧凑型热传感器(<0.02 mm 2)对于测量微处理器中的热梯度非常重要,并且可以直接影响处理器的性能和电源管理。本文报道了第一个14 nm热传感器。该传感器采用Intel的14 nm工艺制造,是该技术中最早报道的模拟电路之一。它的面积为0.0087 mm 2,可以> 50 kS / sec的速度进行感应,功耗为1.1 mW,分辨率为0.5°C,分辨率FOM为5.7 nJ C 2。它在尺寸上非常接近当前的BJT传感器,同时比任何紧凑型BJT传感器都快得多且FOM更好。

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