首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >Noble FeRAM technologies with MTP cell structure and BLT ferroelectric capacitors
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Noble FeRAM technologies with MTP cell structure and BLT ferroelectric capacitors

机译:具有MTP单元结构和BLT铁电电容器的Noble FeRAM技术

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摘要

A 16 Mb 1TIC FeRAM with a novel cell structure has been successfully developed with 0.25 /spl mu/m process technology using (Bi,La)/sub 4/Ti/sub 3/O/sub 12/ (BLT) capacitors for the first time. The developed FeRAM is highly scalable and reliable as a result of applying an MTP (merged top electrode and plate line) structure and BLT stacked capacitor, respectively.
机译:具有新颖的细胞结构的16 MB 1TIC Feram,使用(Bi,La)/ Sub 4 / Sub 3 / O / Sub 12 /(BLT)电容器是为本的0.25 / SPL MU / M工艺技术开发时间。由于施加MTP(合并的顶电极和板线)结构和BLT堆叠电容,发达的Feram是高度可伸缩的并且可靠地可靠。

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