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METHOD FOR MANUFACTURING FERROELECTRIC MEMORY DEVICE HAVING MTP-STRUCTURED CAPACITOR

机译:具有MTP结构的电容器的铁电存储器的制造方法

摘要

PPROBLEM TO BE SOLVED: To provide a method for manufacturing a ferroelectric memory device having an MTP-structured capacitor. PSOLUTION: The method comprises the steps of forming a first insulation film 24 on a semiconductor substrate 21, forming a storage node contact penetrating the first insulation film 24 and coming into contact with part of the semiconductor substrate 21, forming the laminate structure of an lower electrode 32A and a hard mask to be connected to the storage node contact on the first insulation film 24, and forming the film of a layer for forming a second insulation film on the entire surface including the laminate structure. The method further comprises the steps of forming a second insulation film 34A by polishing and flattening the layer for forming a second insulation film until the surface of the hard mask is exposed, exposing the surface of the lower electrode 32A located below the surface of the second insulation film 34A by selectively removing the hard mask, and forming a ferroelectric film 35 and an upper electrode 36 sequentially on the lower electrode 32A and the second insulation film 34A. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:<要解决的问题:提供一种用于制造具有MTP结构的电容器的铁电存储装置的方法。

解决方案:该方法包括以下步骤:在半导体衬底21上形成第一绝缘膜24;形成穿透第一绝缘膜24并与半导体衬底21的一部分接触的存储节点接触;形成层压结构。下电极32A和将要连接到存储节点的硬掩模的第一接触在第一绝缘膜24上形成,并且在包括层压结构的整个表面上形成用于形成第二绝缘膜的层的膜。该方法还包括以下步骤:通过抛光和平坦化用于形成第二绝缘膜的层直到暴露出硬掩模的表面,从而暴露位于第二电极的表面下方的下部电极32A的表面,从而形成第二绝缘膜34A。通过选择性地去除硬掩模,并在下电极32A和第二绝缘膜34A上依次形成铁电膜35和上电极36,从而形成绝缘膜34A。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005026669A

    专利类型

  • 公开/公告日2005-01-27

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC;

    申请/专利号JP20040107840

  • 发明设计人 KWEON SOON YONG;

    申请日2004-03-31

  • 分类号H01L27/105;

  • 国家 JP

  • 入库时间 2022-08-21 22:31:54

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