首页> 外文会议>Electron Devices Meeting, 1996., International >Crystalline-buffer-layer-aided (CBL) sputtering technique for mega-bit ferroelectric memory devices with SrBi/sub 2/Ta/sub 2/O/sub 9/ capacitors
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Crystalline-buffer-layer-aided (CBL) sputtering technique for mega-bit ferroelectric memory devices with SrBi/sub 2/Ta/sub 2/O/sub 9/ capacitors

机译:带有SrBi / sub 2 / Ta / sub 2 / O / sub 9 /电容器的兆位铁电存储器件的晶体缓冲层辅助(CBL)溅射技术

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A crystalline-buffer-layer-aided (CBL) SrBi/sub 2/Ta/sub 2/O/sub 9/ film deposition using two step sputtering technique has been developed through investigation of the interface structure between the Pt bottom electrode and SrBi/sub 2/Ta/sub 2/O/sub 9/. A layer having an amorphous structure, obtained by the Ar sputtering of the first step, leads to a depletion of Bi at the interface, whereas a crystalline structure, obtained by Ar/O/sub 2/ sputtering of the first step, inhibits such depletion. The two step sputtering deposition process is implemented to form a Bi-rich crystalline interface layer which improves the polarization characteristics. The remnant polarization values was improved up to 10 /spl mu/C/cm/sup 2/ by the modified deposition process.
机译:通过研究Pt底部电极与SrBi /之间的界面结构,开发了使用两步溅射技术的晶体缓冲层辅助(CBL)SrBi / sub 2 / Ta / sub 2 / O / sub 9 /薄膜沉积方法。子2 / Ta /子2 / O /子9 /。通过第一步的Ar溅射获得的具有非晶结构的层导致界面处Bi的耗尽,而通过第一步的Ar / O / sub 2 /溅射获得的晶体结构抑制了这种耗尽。 。实施两步溅射沉积工艺以形成富含Bi的晶体界面层,该界面层可改善偏振特性。通过改进的沉积工艺,剩余极化值提高到10 / spl mu / C / cm / sup 2 /。

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